Description

TMC High Power D-Sub Pressfit 90 °

Stamped contacts and installation height 7.3 mm

 

Technical advantages

    Solderless press-fit technology with standard
    elastic press-fit zone
    Inexpensive and reliable connection technology
    No soldering errors, flux problems, no cleaning process and no thermal stress
    Allows mounting on both sides of the panel
    Easy handling with inexpensive press-in tools
    The contact is made on the copper layer
    The high elasticity compensates for large hole tolerances or dimensional changes over the service life
    The pressfit zone ensures a gas-tight connection
    PCB copper layer

Features

    Right angle versions with an installation height of 7.3 mm
    other installation heights on request
    Pin and socket versions
    Turned contacts for high current carrying capacity
    Pin arrangement: 7W2
    Mounting options on circuit board: clip for pressing in
    Suitable accessories: through hole, threaded rivet or threaded bolt